Large-Area Thin-Film Electronics

Solution-Processing of Organic Semiconductors Layers

 

Solution-processing holds great promise for rapid large-area manufacturing of organic semiconductor devices. Using both experiments and numerical process simulations, our group studies deposition methods such as dip-, die- and spin-coating as well as inkjet-printing on pre-patterned surfaces. Optical techniques, such as interferometry, reflectometry and in the future ellipsometry, are applied for the metrology of surface profiles, layer thicknesses and their uniformity, both during and after solvent evaporation and drying. Strategies for the active manipulation of solute distributions and mitigation of the coffee-stain effect are being explored.

 

Case LATFE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Solvent evaporation on chemically patterned surface